Desiccant For Electronics

Introduction

If the device is moved from a cool environment to a warm, humid environment, the circuit board may become covered with moisture. It is important to protect electronics from low humidity environments as it can cause electrostatic discharges that can irreversibly damage components. To solve this problem, we designed this desiccant for electronics. This product has the advantage of being environmentally friendly as it does not contain cobalt chloride and DMF, which ensures that it will not cause additional damage to electronic equipment and the environment. We have selected high-quality materials such as Tyvek bags and non-woven bags as the outer packaging of these desiccants, which can ensure that the internal substances are not leaked at all.

Desiccant for electronics is a natural, non-polluting and non-irritating product that has a wide range of applications. In addition to electronic equipment, there are many other items that are susceptible to moisture, such as metal products, military products and precision instruments. This product can also be used for mildew control of these valuables to help you minimize losses. Plus, it's very easy to use because you place it directly in the environment the item is in and it kicks in. This product is especially suitable for low-cost processing plants to protect equipment from moisture, and can also be used for mildew protection in daily life.

Different Humidity Level Damage Electronics

Brittleness can occur at humidity levels as low as 40 percent, while mildew grows atlevels over 50 percent RH. The range recommended by experts is between 30 and 50 percent RH, and temperatures no higher than 70 degrees Fahrenheit. Similarly to books, electronics are sensitive to extremes of humidity.

Sources of Water Contamination in a closed container or package 

Water vapor in the air inside the package;

Moisture contained in the materials inside the package;

Moisture in or on the walls of the package; and

Entry of moisture into the package due to permeation or leakage

Desiccant used in packaging of electronics

Raw material: clay

Raw material size(ball diameter): 0.5-1.5mm, 1-3mm, 2-4mm, 3-5mm,4-8mm.

Raw material color: grey.

Packing material: Tyvek bag, non-woven bag,dust-free, low dust

Weight : 1/6 UD, 1/3 UD, 1/2 UD, 1 UD, 2 UD....32 UD

Experiment data:

PH: 4.0-8.0

Moisture content: <2% (150 degree ℃)

Stack density: ≧720 g/liter

The adsorption capacity of moisture:23%  

Characteristic:COBALT CHLORIDE FREE,DMF FREE

Certification:SGS,TUV SUD,ISO9001:2015,ISO14001:2015

Test Report:ROHS,MSDS,REACH,FDA